University of Wisconsin - Stout

The Packaging Research and Development Center provides technical support to individuals or manufacturers in the areas of package development, testing, and third party evaluation. UW-Stout's packaging laboratory has state-of-the-art equipment to design, develop and evaluate packages for most product areas. Testing equipment includes shock, vibration, compression, and standard materials tests.

Bob Berkemer , Interim Director; Phone: 715/232-1107 berkemerb@uwstout.edu